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Step#1
Film Generation:
Generated from your design files, we create an exact film
representation of your design. We will create one film
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Step#2
Shear Raw Material:
Industry standard 0.059" thick, copper clad, two sides.
Panels will be sheared to accommodate many boards.
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Step#3
Drill Holes:
Using NC machines and carbide drills.
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Step#4
Electrolus Copper:
Apply thin copper deposit in hole barrels. |
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Step#5
Apply Image:
Apply photosensitive dryfilm (plate resist) to panel. Use
light source and film to expose panel. Develop selected
areas from panel.
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Step#6
Pattern Plate:
Electrochemical process to build copper in the holes and
on the trace area. Apply tin to surface.
note: All PCBexpress boards are plated through holes.
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Step#7
Strip & Etch:
Remove dryfilm, then etch exposed copper. The tin protects
the copper circuitry from being etched.
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Step#8
Solder mask:
Apply solder mask area to entire board with the exception
of solder pads.
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Step#9
Solder coat:
Apply solder to pads by immersing into tank of solder.
Hot air knives level the solder when removed from the
tank.
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Step#10 Nomenclature:
Apply white letter marking using screen printing process.
Step#11 Fabrication:
Route the perimeter of the board using NC equipment
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See our PCB Glossary for more details
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