Advisement to Customers
For immersion processes such as silver (our process), electroless Ni/immersion Au, tin and osp, it is recommended by the manufactures of those products that via holes be cleared of soldermask to assure proper plating and good rinsing. Not everyone adheres to this process, but we strongly recommend it.
Here’s how it works: Unless specifically asked by a customer NOT to modify the soldermask via clearances, we will add or adjust the via clearances so they are slightly larger then the drilled hole. This will leave the hole open and the edges of the pad covered. For the customer, this simply means that you do nothing, we will take care of it.
Customers will often already have a soldermask clearance over the whole pad, in this case we will not make any changes.
Sunstone Circuits reserves the right to add a date code and/or a "RoHS Compliant" marking to the board.
Questions?
If you have any questions regarding this information or anything about our lead free process, please contact our Lead Free Specialist, Tom Hall. Tom can be contacted at 503-829-9108 or e-mailed to thall@sunstone.com |
